The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
CoF (Chip-on-Flex) packaging is widely applied in electronic products, especially in large scale LCD ( Liquid Crystal Display) manufacturing. A high quality flexible display product demanded the whole package structure to be flexible, which caught the attention of researchers to develop the UTC (ultra-thin chip) on flex technology. This paper focused on the interconnection method between ultra-thin...