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The 3D finite element analysis model of flip stacked AU bumps was developed, its stress and strain distribution under random vibration load were analyzed by ANSYS the finite element analysis software. Solder joint height, solder maximum radial size, solider distribution were selected as four key configuration parameters, their impacts on the models' stress and strain distribution were also studied,...
The simulation model of embedded capacitor radiation was established based on HFSS (High Frequency Simulator Structure) software in this paper. Radiation problem of the embedded capacitor at high frequency was studied by the model. Its near-field radiant power gain was obtained and the effects of the variations of the signal frequency, capacitance plate radius and dielectric thickness on radiation...
The 3D finite element analysis model of chip scale package solder joints with compliant layer was established, the thermal-structure finite element analysis of the model was performed, the stress and strain distribution of the solder joints with complaint layer was obtained under the condition of thermal-structure, the influences of the height of solder joints with complaint layer structure were studied...
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