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This paper presents a novel Cu-CMP APC that compensates the high-speed drift of thinning amount during the continuous input of high-mix products. Compensation is realized by estimating the polishing rate as the summation of the estimated standard drift and the amount of shift for each product group. A new algorithm in which the products with similar rates are systematically grouped has also been developed...
Microscratches and microcracks generated by chemical mechanical polishing (CMP) show a photoelasticity effect under stress applied by a piezoactuator. The polarization and intensity of the light scattered from microcracks are found to change. On the basis of the abovementioned effect, microcracks formed on a 200-mm wafer subjected to CMP are inspected, and the detected microcracks are studied by SEM...
We present an advanced FD system that reduces cost of consumables (COC) and improves quality of Cu-CMP process. By applying a pad height sensor, the lifetime of the polishing pad is precisely extracted. This changes the pad replacement maintenance from time-based to wear-based, resulting in 10% longer pad lifetime. In addition, by monitoring these electric currents of both the polishing head and the...
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