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We discuss a metal deposition technique employing electroless silver plating to create hybrid CNT-Metal contact structures which can be used various applications including electromechanical probes. The main purpose of the electroless metal deposition is to enhance the electrical conduction through the contact structures. We discuss different electroless plating formulations and their effect on electrical...
3D IC integration offers a new paradigm of system assembly, which enables further miniaturization and new architectures driven mostly by the next generation mobile electronics applications which require larger bandwidth, lower power consumption, smaller footprints and reduced cost. However, 3D integration presents test challenges and demands new test techniques. For the economic assembly of 3D stacks,...
Vertically aligned carbon nanotube (CNT) forests may be used as miniature springs, compliant thermal interfaces, and shock absorbers, and for these and other applications it is vital to understand how to engineer their mechanical properties. Herein is investigated how the diameter and packing density within CNT forests govern their deformation behavior, structural stiffness, and elastic energy absorption...
Testing of Through Silicon Via (TSV) and Micro-Bump (MB) devices by physical connection through the TSVs presents unique challenges due to the very high density of the connections, and the potential impact of contact testing on subsequent assembly steps. In addition, the very high signal counts that are the main benefit of TSV connection schemes make conventional wafer probing, particularly for memory...
This paper discusses a method to fabricate contact structures using carbon nanotubes (CNTs) and thin film metal deposition which can be used in applications such as electromechanical probes. We discuss the electrical resistance of CNT structures and electrical enhancement schemes using various metal deposition techniques including sputtering and electroless metal plating. Functional CNT-metal composite...
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