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In 3D through-silicon-via (TSV) interposer package, there are large numbers of micro bumps and micro solder balls, the sizes of the entities in the package having a difference of 3 orders of magnitude. This multi-scale structure brings difficulties to establish the finite element model for analyzing the thermal fatigue life of board-level solder joint. Homogenization method is adopted to avoid these...
In this paper, both isothermal and dynamic differential scanning calorimetry (DSC) are employed to characterize the thermal properties of two commercial epoxy molding compounds designated as EMC-A and EMC-B respectively. In dynamic curing, the heat flow of uncured powder samples weighting 10±0.5 mg are measured at the heating rates of 5, 10 and 15 °C /min from room temperature to 220 °C. The isothermal...
In 3D through-silicon-via (TSV) interposer package, there are large numbers of micro bumps and micro solder balls, the sizes of the entities in the package having a difference of 3 orders of magnitude. This multi-scale structure brings difficulties to establish the finite element model for analyzing the thermal fatigue life of board-level solder joint. Homogenization method is adopted to avoid these...
In this paper, both isothermal and dynamic differential scanning calorimetry (DSC) are employed to characterize the thermal properties of two commercial epoxy molding compounds designated as EMC-A and EMC-B respectively. In dynamic curing, the heat flow of uncured powder samples weighting 10±0.5 mg are measured at the heating rates of 5, 10 and 15 °C /min from room temperature to 220 °C. The isothermal...
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