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The thermal influence of the topology of the COB (Chip-on-Board) LED modules is examined. For this purpose CFD simulations of a powerful COB LED module thermal model are carried out and the thermal distribution at different locations of LED chips is analyzed. Simulation experiments are designed, using the substrates of ceramic materials - Alumina (Typical), Alumina (94 %), Alumina (96 %) and AlN....
Potential applications of different thermography techniques for the fault diagnostic in packaged integrated circuits (ICs) in order to detect, evaluate, and localize latent and hidden defects are discussed. We present the four basic thermography techniques for qualitative and quantitative non-destructive diagnostic of sub-surface defects — passive, pulsed, step-heating, and lock-in. The results and...
This paper presents the results from research on the application of Infrared Thermography (IRT) for sub-surface defect evaluation in organic solar cells (OSC). The research was carried out with the three types of test samples: OSC without defects, with unknown and with known types of defects and evaluated localized defects. Passive as well as active thermography for the sub-surface defect detection...
The paper presents an equivalent circuit of LNA with different ESD protection structures, which are used to discharge the excess power. The two different circuits are physically implemented and extracted in 0.18µm CMOS technology. The goal is to realize LNA with ESD protection and to run post extract simulations, to see how parasitic elements influences of the LNA's work under certain conditions....
A behavioral model of polycrystalline solar module ET-P660230WW applying semi-empirical approach is presented. The model equations are coded in Matlab. The simulation results are verified against the data provided in the data sheet of the module.
Gate-grounded NMOS is often used as ESD protection for circuit design. The ESD behavior of the NMOS transistor is based on the snapback action of its parasitic, lateral NPN BJT. Modeling this behavior of NMOS devices is very important for design of ICs, because there are no standard models, which can be used for describing high current regions in the NMOS snapback characteristic. In this paper an...
The temperature is an important physical parameter influencing hybrid integrated circuit (HIC) performance and reliability. Different interesting techniques using infrared thermography have been proposed. However, they do not give an absolute temperature, require an electronic system to synchronize the camera and the electronic device or have difficulties to obtain relevant thermograms because of...
The aim of this work is therefore to analyze the thermal stability by lifetime accelerated tests for three different constructions of LED lighting fixtures. In result of studied we believe to provide information on the role of temperature in determining devices degradation, since in most of the cases high current and high temperatures acted as degradation driving forces. In order to high light the...
The following paper aims to present work done towards provoking and organizing discussion and gathering information and feedback on message boards regarding MCM design and use. In order to accomplish that, information was presented on the Internet allowing the creation of a virtual community, dedicated to discussing specific topics on MCM design and use. Through discussion it was possible to obtain...
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