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Advanced Process Control is an important research area in Semiconductor Manufacturing to improve process stability crucial for product quality. Actual research focuses on Virtual Metrology (VM) using high sophisticated Machine Learning methods to predict a predefined metrology target based on statistical models trained on historical data. Enhancing physical metrology by predictive models leads to...
The quality of wafer production in semiconductor manufacturing cannot always be monitored by a costly physical measurement. Instead of measuring a quantity directly, it can be predicted by a regression method (virtual metrology). In this paper, a survey on regression methods is given to predict average silicon nitride cap layer thickness for the plasma-enhanced chemical vapor deposition dual-layer...
Advanced Process Control (APC) is an important research area in Semiconductor Manufacturing (SM) to improve process stability crucial for product quality. In low-volume-high-mixture fabrication plants (fabs), Knowledge Discovery in Databases is extremely challenging due to complex technology mixtures and reduced availability of data for comparable process steps. High Density Plasma Chemical Vapor...
Advanced Process Control is an important research area in Semiconductor Manufacturing to improve process stability crucial for product quality. Especially in low-volume-high-mixture fabrication plants, knowledge discovery in databases is extremely challenging due to complex technology mixtures and reduced availability of data for comparable process steps. Thus, actual research focuses on Data Mining...
Within the ENIAC project “IMPROVE”, new algorithms for virtual metrology and predictive maintenance are being developed to substantially enhance efficiency in European semiconductor manufacturing. The consortium comprises important IC manufacturers in Europe, solution providers, and research institutions. A major objective of the project is to make these new APC methods applicable in the existing...
Different approaches for the prediction of average Silicon Nitride cap layer thickness for the Plasma Enhanced Chemical Vapor Deposition (PECVD) dual-layer metal passivation stack process are compared, based on metrology and production equipment Fault Detection and Classification (FDC) data. Various sets of FDC parameters are processed by different prediction algorithms. In particular, the use of...
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