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System-in-package (SiP) has been adapted as one of the most promising packaging technologies with the development of mobile devices. It could greatly reduce the package size and enhance the device performance. As the electronic packaging technology progresses quickly, various SiPs have been designed and the structure of SiP is becoming more diversified. However, the relatively complex structure of...
A typical 3D-BGA packaging model was set up and numerical simulation method was used to study its thermal field and thermal stress field distribution when chip works on a given power. Different heat convection coefficients and packaging materials had been applied to study their effects on the temperature and stress field. The results show that the influence on the temperature and stress field decreases...
System-in-package (SiP) has been adapted as one of the most promising packaging technologies with the development of mobile devices. It could greatly reduce the package size and enhance the device performance. As the electronic packaging technology progresses quickly, various SiPs have been designed and the structure of SiP is becoming more diversified. However, the relatively complex structure of...
System-in-package (SiP) has been adapted as one of the most promising packaging technologies with the development of mobile devices. It could greatly reduce the package size and enhance the device performance. As the electronic packaging technology progresses quickly, various SiPs have been designed and the structure of SiP is becoming more diversified. However, the relatively complex structure of...
System-in-package (SiP) has been adapted as one of the most promising packaging technologies with the development of mobile devices. It could greatly reduce the package size and enhance the device performance. As the electronic packaging technology progresses quickly, various SiPs have been designed and the structure of SiP is becoming more diversified. However, the relatively complex structure of...
A typical 3D-BGA packaging model was set up and numerical simulation method was used to study its thermal field and thermal stress field distribution when chip works on a given power. Different heat convection coefficients and packaging materials had been applied to study their effects on the temperature and stress field. The results show that the influence on the temperature and stress field decreases...
Three-dimensional numerical simulation model is constructed. Temperature field of the package with power chip (3W) is analyzed under unsteady-state condition during its working process. Five convection boundary conditions are applied to analyze their influence on heat dissipation; then, three cover materials and three thickness adhesives between the cover and the chip are used to study their influence...
In this paper, the mould for producing high conductivity aluminum alloy used in electronic packaging has been designed. The three-dimension model is established and extrusion process is simulated by the software DEFORM-3DTM. The paper researches the distribution of the stress and strain under different extrusion velocities and temperature. The numerical simulation results show that the optimum temperature...
According to simulation results of the temperature, thermal stress of electronic package is analyzed by thermal-mechanical sequential coupling method. The results show that higher thermal stress are located in the place around power chip when the stress neighboring the periphery of the package is lower and the maximum thermal stress locates at the contact site between the cover and the substrate....
Thixoforming has already been used in the field of electronic packaging. The main problem in the production is the lack of the mathematic models which describe the thixotropy of the semi-solid metal and alloy. In this paper the effects of thixotropy to the flow characteristics and material properties are researched. The paper uses the Herschel-Bulkey model to describe the constitutive equation. The...
In this paper, SiCp/Cu composite billet was prepared by powder metallurgy and thixoforming process of electronic packaging shell with SiCp/Cu composite was simulated by the finite element software DEFORM-3D. Microstructure of SiCp/Cu composite billet was studied and the results showed that composite billet prepared by powder metallurgy was dense and the combination between SiC particles and Cu matrix...
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