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This paper presents high frequency characterization data of the commonly used 3D-printing material Acrynolitrile Butadiene Styrene (ABS). A cavity resonator was used to characterize the material around 30 GHz. The extrapolated data was used to design a microstrip patch antenna around 25 GHz. The antenna was fabricated using a combination of fused deposition modeling (FDM) and direct print additive...
We demonstrate a fully integrated 2×2 SiGe transmitter array at 316 GHz. A novel method is introduced to phase-lock the high frequency signal sources without any additional circuitry. This method suppresses the other possible oscillatory modes automatically. The power of the locked signal sources are combined in the air by the 2×2 on-chip antenna array which are fed with the locked sources. This array...
This paper, for the first time, presents successful integration of a -band antenna with an organically flip-chip packaged silicon–germanium (SiGe) low-noise amplifier (LNA). The successful integration requires an optimized flip-chip interconnect. The interconnect performance was optimized by modeling and characterizing the flip-chip transition on a low-loss liquid crystal polymer organic substrate...
This paper presents for the first time, the use of a microfluidic channel with organic substrates to reduce the size of different antenna designs at 915 MHz (dipole and loop). The channel was created by drilling a cavity on a 50 mil RO3003™ substrate and bonding it to two 5 mil substrates in order to seal the structure. Compared to designs fabricated on an unperturbed substrate, the overall size reduction...
This paper presents, for the first time, the integration of V-Band and W-Band antennas with SPDT switch on organic Liquid Crystal Polymer (LCP) substrate. A wideband chip to package wire-bond transition was designed so that the insertion loss is minimized. The antennas were designed and optimized for frequency operation at 57 and 80 GHz with a gain of 10.5 and 9.5 dBi. The gain, S11, E-plane and H-plane...
This paper presents a combination of two broadband dipole antenna arrays packaged in multilayer organic (MLO) substrates at 57 and 80 GHz. The two arrays are fed via a Tee-junction, in a 45 degree configuration. It is shown that simultaneously integrating antennas at these frequencies is possible. Good performance and isolation was obtained for both antennas, with greater than 10% bandwidth. When...
This paper presents for the first time a hybrid silicon-organic packaged mm-wave antenna, that is flip-chip bonded to a 400 µm thick silicon substrate through gold bumps and a non-conductive film (NCF) adhesive layer. The antenna was made on RO3003™. Two different antennas were designed, at 60 and 80 GHz respectively. It is demonstrated that the silicon substrate can be successfully integrated into...
RXP is a novel and emerging low loss thin core experimental material that has shown promising results as an RF dielectric substrate. In this paper, Ring Resonator Method was utilized to characterize its dielectric properties (relative permittivity and loss tangent) from 30 to 70 GHz frequency domain. BT, a PCB compatible substrate, and RO3003™, an RF organic material, were also characterized for the...
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