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A 256 Gb NAND flash memory multi-chip package (MCP) includes eight stacked 32 Gb 2 bit/cell multi-level cell (MLC) die and an 11.6 HyperLink NAND bridge chip providing four internal NAND channels for concurrent memory operations. The bridge chip provides an external 1.2 V unidirectional byte-wide point-to-point source-synchronous double data-rate (DDR) interface for low power 800 MB/s...
The design techniques used to implement the analogue portions of a single-chip digital subscriber loop transceiver are described. The device provides a full-duplex communication link at l60Kb/s or 80Kb/s over 4Km or 5Km, respectively, of 0.5??m twisted-pair cable. The 22-pin 27.7mmsq 3um double poly CMOS IC consumes 50mW from single 5 volt supply.
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