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High speed 3D interconnects are a key element in 2.5D interposer technology that is widely investigated for high performance applications. A wide-band electrical modeling and optimization method of the photonic interposer interconnect chains is presented using scalable models developed based on electromagnetic simulations. Resulting models enable fast and accurate assessment of the whole-chain performances...
The continuous requirement of higher communication bandwidths in data centers or high performance computers drives the convergence between ASICs and optical I/Os. Combining 3D integration and Si-photonic technologies on a photonic interposer platform would offer tremendous opportunities for performance improvement assuming that 3D electrical paths are efficiently managed. Routing strategies for die-to-die...
Integrated trench high density MIS (Metal Insulator Semiconductor) capacitors in Si-interposer are of great interest as they provide decoupling in a smart way using the third dimension of the silicon substrate. However, the use of various highly integrated passive components on the same Si-interposer is challenging regarding wide frequency band performances and signal integrity. Both aspects are addressed...
This paper presents an extended wide-band physical scalable model developed at LETI for 3D high density trench decoupling capacitors manufactured by IPDIA. The capacitors provide a density of 80 nF/mm2 and are embedded in a high resistivity silicon substrate. Use of such capacitors for mixed circuits decoupling and filtering applications requires wide-band SPICE models. Therefore, a focus is done...
Bipolar VCO and prescaler for 5GHz low cost wireless applications are presented. These circuits are implemented in a 0.35?m BiCMOS SiGe process (FT=45GHz). Phase noise value for a 4.82GHz bipolar VCO is ?12ldBc/Hz at 1MHz frequency offset. Based on CML architecture, a 5GHz 7/8 prescaler is designed and tested. These circuits are the two HF critical buildings blocks in designing wireless communication...
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