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• Embedded technology is everywhere and reducing in size • One important example is heterogeneous integration including anisotropic or differential cooling • Moving to thermally anisotropic substrate decreases the safe distance between the power dissipating and the temperature sensitive chips by 5 X. • TLPS joints can be used to seal 3D integrated coolers • TEC can be added to 3D integrated cooler...
Presents the power point presentations from the conference proceedings. • Power electronics is the critical enabling technology at the intersection of renewable power generation, reliable power distribution and transmission, and efficient power utilization and storage. • Issues of compact and high power density packaging, thermal management and reliability are the most important research areas for...
This paper investigates the effort to improve the reliability of a power module using physics-of-failure based approach. Thermal simulation of the power module board with the heat sink has been carried out and further these results have been used for estimating the overall thermal cycle reliability. Solder joint reliability has been investigated using two different kinds of solders -SAC and Eutectic...
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