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Electroless Cu plating has been used in PCB industry when circuit was made upon non-conductive substrate. Adhesion is getting important since the size of L/P is reduced. The adhesion of copper on substrate is mainly dependent on Pd activation and copper seeding. In this study the methods of Pd activation were varied and the effects of ultrasonic process were investigated. The thickness of copper layer...
In this paper, effects of leakage inductance components in active clamped flyback inverter are analyzed. In this active clamped flyback inverter, the leakage inductance influences on the control time of the active clamp switch, the voltage across the primary switches, and the resonant capacitor selection. Therefore, it is essential to analyze the effects of leakage inductance for design of flyback...
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