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Operating temperature and temperature gradients are of critical concern in the design of planar integrated circuits (ICs) and are bound to be exacerbated in the upcoming 3D technologies. However, a thermal aware design of ICs allows thermal issues to be kept to the minimum. Previously, a simulator integrated in the Cadence® environment that allows electro-thermal simulations to be carried out at transistor...
High power density in integrated systems creates rises of temperature and gradient across the chip that can deteriorate the electrical performances of the system. In 3D stacked technologies, on chip power density will be even more important while heat spreading will be reduced leading to more thermal issues. Thus, it is very important for designers to have a powerful and reliable electro-thermal simulator...
The constant scaling of integrated devices is accompanied by an increase of on-chip current and power densities which are responsible for important thermal issues. Designers need efficient electro-thermal simulators to deal with such issues. The paper presents a simulator which allows to take accurately the thermal aspects into account through the coupling of an automatically generated thermal network...
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