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The fabrication of near eutectic Sn-Bi alloy can be developed by reflowing a metal stack containing layers of Sn and Bi films. The Sn and Bi metal films are sequentially electroplated using two separate plating baths. Composition control of Sn-Bi alloy can be achieved by manipulating the thickness of constituent metal films. The thickness ratio of Sn to Bi is targeted to be approximately 0.97 to obtain...
Sulfuric acid based Sn-Ag plating baths were developed to study the individual as well as synergistic effects of thiourea (TU) and gelatin on the characteristics of Sn-Ag deposits. Electrochemical behavior of each bath was investigated by cathodic polarization studies. Results showed that the deposition potential gap of both elements was reduced by both additives, hence allowing co-deposition of Sn-Ag...
Sn-Bi alloys were electroplated from sulphuric acid based plating baths containing tin sulfate (SnSO4) and bismuth nitrate (Bi(NO3)3). The electrochemical behavior of the plating bath was investigated by electrochemical studies. Potentiodynamic polarization curves of the plating bath revealed the large potential gap between the two elements. The effects of SnSO4 concentration and current density on...
In this research, the effects of Mn nanoparticles on wettability and interfacial intermetallic compounds in between Sn-3.8Ag-0.7Cu (SAC) solder and copper (Cu) substrate was investigated. The nanocomposite solders were fabricated by mechanical mixing of SAC solder paste with Mn nanoparticles. The melting characteristic of the solders was characterized by differential scanning calorimeter (DSC). The...
The effects of an antioxidant, hydroquinone (HQ) and a grain refining additive, gelatin, on the electroplating characteristics of SnBi alloys were investigated. Methane sulfonic acid (MSA) based plating baths with varying contents of additives are prepared and the electrochemical behavior of each bath was investigated. Cathodic polarization studies showed that the presence of HQ possesses insignificant...
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