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Moore's Law scaling is continuing to yield even higher transistor density with each succeeding process generation, leading to today's multi-core Chip Multi-Processors (CMPs) with tens or even hundreds of interconnected cores or tiles. Unfortunately, deep sub-micron CMOS process technology is marred by increasing susceptibility to wearout. Prolonged operational stress gives rise to accelerated wearout...
With advancing process technology, Chip-Multiprocessors (CMPs) are experiencing ever worsening reliability due to prolonged operational stresses. The network-on-chip that interconnects the components of CMPs is especially vulnerable to such wearout-induced failure. To tackle this ominous threat we present Clotho, a novel, wearout-aware routing algorithm. Clotho continuously considers the stresses...
Downscaled complementary metal-oxide semiconductor (CMOS) technology feature sizes have enabled massive transistor integration densities. Multi-core chips with billions of transistors are now a reality. However, this rapid increase in on-chip resources has come at the expense of higher susceptibility to defects and wear-out. The inter-router communication links of networks-on-chips (NoCs) are composed...
The rapid scaling of silicon technology has enabled massive transistor integration densities. Nanometer feature sizes, however, are marred by increasing variability and susceptibility to wear-out. Billion-transistor designs, such as chip multiprocessors (CMPs), are especially vulnerable to defects. CMPs rely on a network-on-chip for all their communication needs. A single link failure within this...
Silicon technology scaling is continuously enabling denser integration capabilities. However, this comes at the expense of higher variability and susceptibility to wear-out. With an escalating number of on-chip components expected to be defective in near-future chips, modern parallel systems, such as Chip Multi-Processors (CMP), become especially vulnerable to these faults. Just a single link failure...
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