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The integrated 3D configuration considered in this study includes a silicon die on one side of an organic interposer and a different die on the other side. The three parts are from three different design environments, each has its own database and description language not compatible with the other two. The incompatibility triggered a search for a new methodology for the physical verification of the...
Interests in advancing 3D design and integration have stimulated this study of connecting two different silicon dies using an organic interposer. This paper reports some of the challenges encountered by the system and silicon designers during the process of 3D integration. The discussion focuses on ways to improve the efficiency of the design flow, integration and verification of a 3D configuration...
Next generation processor and DRAM memory for mobile phones are expected to provide the higher bandwidth (BW) necessary for full high definition (HD) video recording. The power consumed by current mobile phones and a camcorder was measured during video capture and extrapolated to estimate the power requirements of 1920×1080p recording at 60 and 120 fps. CMOS process and voltage scaling was then applied...
This paper demonstrates that determining the electrical and thermal sensitivity of the system and its components is important to a successful electrical-thermal co-design of a high speed data link. A temperature control setup that can thermally isolate each component of a data link is presented. The transmitter, receiver, PCB and other parts of a data link running at 3.2 Gbps were tested at temperatures...
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