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As support materials of integrated circuits, lead frame is the key structural components to the formation of the electrical circuits, played a role in the internal and external wire connections. As one of the commonly used lead frames at present, 5–8µm copper plating layer above of FeNi42 alloy often been found deep red color after chip welding. Aiming at this phenomenon, this paper collected large...
(****)Aimed at the unstable output phenomenon of one type of power amplifier in the process of using, previous examinations have located the problem in internal inductance coil. To determine the reason of the fault amplifier, scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) have been used to analyze the microstructure and composition of abnormal substances in the bend of...
Based on the phenomenon that a large number of spots appear in the type area on the surface of the gold-plated kovar alloy cavity, combined with scanning electron microscope (SEM) and energy disperse spectroscopy (EDS) analysis method, this paper analyzed the causes of spots and promoted effective encapsulation of electronic components. The result shows that uneven laser typing edge affect the smoothness...
Based on the phenomenon that a large number of spots appear in the type area on the surface of the gold-plated kovar alloy cavity, combined with scanning electron microscope (SEM) and energy disperse spectroscopy (EDS) analysis method, this paper analyzed the causes of spots and promoted effective encapsulation of electronic components. The result shows that uneven laser typing edge affect the smoothness...
(****)Aimed at the unstable output phenomenon of one type of power amplifier in the process of using, previous examinations have located the problem in internal inductance coil. To determine the reason of the fault amplifier, scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) have been used to analyze the microstructure and composition of abnormal substances in the bend of...
An electron beam inducing method for sprouting large quantities of silver nanoparticles on the surface of silver chloride particles is reported. The electron beam driven process was characterized by time‐dependent scanning electron microscope (SEM) and energy dispersive spectrum (EDS), allowing for observing several key intermediates in and characteristics of the growth process. Theoretical calculation...
Aiming at the problem of electric loss rises, the qualified and the failed phase shifters were employed for comparative analysis in this paper. The morphology and micro-composition after chemical unsealing were analyzed by using scanning electron microscope and electron probe energy disperse spectroscopy. The comparative results showed that the plastic surface of the capacitor near the output was...
As semiconductor industry strives to keep pace with the rapidly shrinking feature size and ever-smaller chip size, surface sensitivity has increased gradually especially on micro-chips. Stronger emphasis must be placed on chip contamination to achieve higher reliability. Phase shifter chip employed in this paper was contaminated on the surface. By combining scanning electron microscopy and X-Ray spectroscopy,...
Plating permeation in the process of nickel and tin electroplating greatly reduced soldering reliability of products and drawn particularly attention from MLCC manufacturers. Based on the results of SEM and EDS analysis, it indicated that the silver end terminations spread from edges to middle in the surface of ceramic body in sintering process, and formed a lOOLim width transition areas near silver...
Owing to the trend of the miniaturization and high density, conductive adhesive is regarded as the new promising kind of electronic packaging and bonding materials. Reliability of adhesives has been one of the key issues in practical applications. A phenomenon occurred on packaging solder joint of silver-filled adhesive, which declined the normal performance and reliability of phase shifter, was presented...
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