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Recently the active-matrix organic light-emitting diode (AMOLED) has emerged as a very promising flat-panel display technology because of its potential widely application for the development of high resolution and flexible full color flat panel displays. However, the encapsulation of AMOLED is studied and developed due to the top-emission structure used in AMOLED. Different from the bottom-emission...
A semi-automatic laser bonding system is developed to provide a localized heating manner for semiconductor device and MEMS encapsulation, especially for devices which have thermal-sensitive materials inside. This system consists of five modules, including laser module, motion module, fixture module, monitoring module and control module. Several bonding tests are carried out using this system with...
Organic light-emitting device (OLED) is regarded as the potential application for future display. However, one of the bottlenecks is the OLED package issue, which results in short term device lifetime. Currently, a new laser bonding package process is proposed. In this paper, the investigation of transient temperature field analysis for the laser bonding process is presented. Finite element model...
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