The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.
The stress sensing system, which has been developed recently, allows measuring the magnitudes and the distribution of mechanical stresses induced in the silicon dies during fabrication and testing of the electronic packages. The studies already presented in the last years focused on the effects of temperature cycling, 4-point-bending, moisture swelling, and molding. This paper reports the results...
The ongoing need for miniaturization and speed in electronics industry has brought a requirement for better performing thermal management systems. One of the major bottlenecks in thermal management is the thermal interface resistance. Characterisation of thermal interface materials become even tougher a challenge at low bond line thicknesses and higher thermal conductivities of the interface materials...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.