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Various fault-tolerance techniques have been proposed in recent years to tolerate the high defect rates expected in emerging nanofabrics with unconventional nano-manufacturing techniques. The proposed techniques include modular redundancy schemes that use majority voters to vote on the '0' or 1' outputs of redundant modules. Novel nanoscale computational fabrics employ new circuit and logic styles...
Advancing technology nodes have increased the impact of lithography variation on design yield and performance. Although lithographic distortion is emerging as the dominant mode of failure, particulate defect still remains an important source of defect. In this work, we present a novel critical area analysis technique that deals with non-deterministic line edges that arise due to statistical lithography...
Several nanoscale-computing fabrics based on novel materials such as semiconductor nanowires, carbon nanotubes, graphene, etc. have been proposed in recent years. However, their integration and interfacing with external CMOS has received only limited attention. In this paper we explore integration challenges for nanoscale fabrics focusing on registration and overlay requirements especially. We address...
Current printability issues can be attributed to sub-wavelength lithography and its sensitivity to manufacturing process variations. Resulting process variations cause performance, yield and reliability problems. As noted in ITRS, conventional burn-in test is losing cost-effectiveness in reliability screening. In this paper, we use lithography process corner information in reliability screening. The...
This fabric update summarizes recent advances for the Nanoscale Application Specific Integrated Circuits (NASICs) nanoscale computing fabric. We provide a brief overview of NASICs, and discuss recent work at all fabric levels. We present advances in device design and optimization including omega gated and junctionless nanowire field effect transistors, methodologies for validation of functionality...
Reliable and scalable manufacturing of nanofabrics entails significant challenges. Scalable nanomanufacturing approaches that employ the use of lithographic masks in conjunction with nanofabrication based on self-assembly have been proposed. A bottom-up fabrication of nanoelectronic circuits is expected to be subject to various defects and identifying the types of defects that may occur during each...
Emerging nano-device based architectures are expected to experience high defect rates associated with the manufacturing process. In this paper, we introduce a novel built-in heterogeneous fault-tolerance scheme, which incorporates redundant circuitry into the design to provide fault tolerance. A thorough analysis of the new scheme was carried out for various system level metrics. The implementation...
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