Search results for: Fulong Zhu
article
Angewandte Chemie International Edition > 62 > 32 > n/a - n/a
Lithium sulfide (Li2S) is considered as a promising cathode material for sulfur‐based batteries. However, its activation remains to be one of the key challenges against its commercialization. The extraction of Li+ from bulk Li2S has a high activation energy (Ea) barrier, which is fundamentally responsible for the initial large overpotential. Herein, a systematic investigation of accelerated bulk Li...
article
Angewandte Chemie > 135 > 32 > n/a - n/a
Lithium sulfide (Li2S) is considered as a promising cathode material for sulfur‐based batteries. However, its activation remains to be one of the key challenges against its commercialization. The extraction of Li+ from bulk Li2S has a high activation energy (Ea) barrier, which is fundamentally responsible for the initial large overpotential. Herein, a systematic investigation of accelerated bulk Li...
article
Chemistry – A European Journal > 26 > 61 > 13779 - 13782
Ferroelectricity has an excellent reversible polarization conversion behavior under an external electric field. Herein, we propose an interesting strategy to alleviate the shuttle effect of lithium–sulfur battery by utilizing ferroelectric metal–organic framework (FMOF) as a host material for the first time. Compared to other MOF with same structure but without ferroelectricity and commercial carbon...
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The European Physical Journal Plus > 2019 > 134 > 5 > 1-12
. Molecular Dynamics (MD) simulations are carried out to study the thinning mechanism of silicon wafer containing through silicon via (TSV) at different loading conditions. The nano-metric grinding process is explained by lattice slip and distortion induced by tool extrusion. When the grinding depth is relatively low, amorphous silicon will appear on the surface of the silicon. The nano-twin defects...
chapter
Lower energy consumption, higher conversion efficiency, and longer life lead to a widely use of light emitting diode (LED) in illumination applications. However, the long product life makes it difficult to do reliability test due to the long time it cost. Generally, the reliability performance of the LED is evaluated by thermal cycling and thermal shock. In this paper, a new reliability testing method...
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Journal of Electronic Materials > 2017 > 46 > 8 > 4733-4739
The thermal properties of graphene and Ni-coated graphene have been investigated using non-equilibrium molecular dynamics simulations. The results showed that the thermal conductivity of Ni-coated graphene was lower than that of graphene. More excited low-frequency phonons resulted in this decrease. The thermal conductivity of single-layer Ni-coated graphene was 70% of that of graphene, and the thermal...
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Wire bonding is one of the most important processes which connected the die and lead frame in LED packaging. Compared with other interconnect technology, wire bonding is much easier to be accomplished. Nevertheless, the gradual increased price of gold makes the cost of bonding increased. As a substitute material of gold, copper comes into sight. Its electrical conductivity is 30% higher than gold...
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Three-dimensional integrated circuit as an extension of the conventional two dimensional processes is viewed as the best choice to continue Moore's law. The extreme miniaturization of size and the complication combination of structure of 3-D integrated circuit make a higher request to the relevant technologies including wafer thinning. Be living in the process of finding the new principle of wafer...
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Computational Materials Science > 2016 > 117 > C > 294-299
In this paper, the mechanical properties of a single-crystal copper nanosheet and graphene nanoribbon-embedded copper (GNR/Cu) nanocomposites are investigated using the molecular dynamics (MD) method. Five different simulation models are used to investigate the effects of chirality, number of graphene layers, and temperature on the mechanical properties of GNR/Cu nanocomposites. The results show that...
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Molecular dynamics simulations are used to investigate mechanical properties of < 1 0 0 >, < 1 1 0 > and < 1 1 1 > oriented copper nanowires under different torsional loading rate and temperature. The embedded-atom potential is employed to describe the interactions between Cu atoms. The effects of loading rates and temperature on the critical angle of Cu are discussed. These results...
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Thermal properties of different metal/graphene interfaces were analyzed by molecular dynamics (MD). Thermal interface conductance of three metal/graphene interfaces, Ni/graphene, Cu/graphene, and Au/graphene, was investigated from 200K to 500K. For Cu/single-layer graphene (SLG) and Ni/SLG interfaces, thermal interface conductance was independent of temperature. Thermal interface conductance was around...
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During the process of power electronic packaging, the warpage of substrate is one of the key parameters in affecting the quality and reliability of microelectronics products. In order to develop the reliability of microelectronics products and reduce the costs, the measurement of the warpage of microelectronics components is essential. In this paper, an array of DBC substrate which two edges were...
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Defects could be inevitably generated during the growth or the artificial operation of graphene. The existence of structure defects could be influence to excellent properties of graphene. Non-equilibrium molecular dynamics (NEMD) simulations was used to investigate the thermal conductivity of graphene with single vacancy (SV) and stone-wales (SW) defects. Dependence of temperature showed that thermal...
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The reliability of electric connection and a stable contact resistance value is usually the most important thing for electrical connector, especially for the electrical connector used in severe environment such as frequently vibration. The present study has investigated the relationship between shrink range and contact resistance of a kind of electrical connector by using the ANSYS software. A indirect...
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The paper investigates the insertion force and contact reliability of N electric connector. A finite element model (FEM) of the contacts was created and simulation of the contact force was completed by ANSYS. Impact of the friction coefficient, shrink range, length of socket, and groove width on the insertion force was analyzed by changing the structural parameters. Variation curves of the insertion...
chapter
During the process of power electronic packaging, the warpage of substrate is one of the key parameters in affecting the quality and reliability of microelectronics products. In order to develop the reliability of microelectronics products and reduce the costs, the measurement of the warpage of microelectronics components is essential. In this paper, an array of DBC substrate which two edges were...
chapter
Defects could be inevitably generated during the growth or the artificial operation of graphene. The existence of structure defects could be influence to excellent properties of graphene. Non-equilibrium molecular dynamics (NEMD) simulations was used to investigate the thermal conductivity of graphene with single vacancy (SV) and stone-wales (SW) defects. Dependence of temperature showed that thermal...
chapter
The reliability of electric connection and a stable contact resistance value is usually the most important thing for electrical connector, especially for the electrical connector used in severe environment such as frequently vibration. The present study has investigated the relationship between shrink range and contact resistance of a kind of electrical connector by using the ANSYS software. A indirect...
chapter
This work investigated mechanical behaviors of graphene and graphene coated with Ni (graphene-Ni) by using molecular dynamics (MD) method. By performing the MD simulation for uniaxial tension simulations, it could be noted that the graphene is more unstable than graphene-Ni at the same temperature from the result of molecular dynamics simulation for two models. It is observed that nickel atoms coated...
chapter
The existence of structure defects can be influence to properties of carbon nanotubes (CNTs). Effect of vacancy defects on heat conduction in CNTs is revealed by nonequilibrium molecular dynamics (NEMD) simulations. The thermal conductivity of (6,6) single-walled carbon nanotubes (SWCNTs) with various numbers of vacancy defects is investigated in this work. It is demonstrated that the thermal conductivity...
