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This paper presents evaluation results of conducted noise suppression effect of a ferrite film directly plated on an interposer substrate in the long-term evolution (LTE) communication band. A test board for evaluations has an IC with digital and RF circuits which is designed for investigations of electromagnetic noise coupling at the IC chip level. Firstly, we have confirmed effectiveness of a ferrite...
In this paper, a new concept providing not only compactness of a filtering component, but also its effective integration in a chip-package system has been presented. This concept is based on a three-dimensional (3-D) design approach and an anisotropic artificial dielectric of a high permittivity formed in a predetermined area of a multilayer substrate used to construct the component. In the 3-D approach,...
A contribution to development of compact and cost-effective bandpass filters in a multilayer substrate is presented. Miniaturization of the filters is achieved by a three-dimensional (3-D) design approach and an anisotropic artificial dielectric of a high permittivity. The 3-D approach is provided by the use of both a planar transmission line and a vertical interconnection formed by signal and ground...
Novel concept of bandpass filters focused on their miniaturization, cost-effectiveness and high integration in a chip-package system has been discussed in the paper. This concept is based on a three-dimensional architecture, in which both a vertical transition and a planar transmission line disposed in a multilayer substrate, are used as building blocks of the filters. Here, the vertical transition...
In this paper, a contribution to development of electromagnetic bandgap (EBG) structures which can be implemented by means of multilayer board technologies in an electronic system is presented. Introduced structures are formed as a transmission line analogue of the distributed Bragg reflector in which the unit cell comprises a stripline segment and a via structure. As the via structure, both a single...
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