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A newly developed bovine-human reassortant pentavalent vaccine (BRV-PV, ROTASIIL®) was tested for its potential effect on the immunogenicity of concomitantly administered EPI vaccines in infants in a randomized controlled study in India.In this Phase III, multicenter, open label, randomized, controlled study, three doses of BRV-PV or two doses of Rotarix® and one dose of placebo were given to healthy...
Background and Objectives Intrauterine growth restriction is associated with increased perinatal mortality and morbidity, possibly extending also in adult life, as compared to fetuses and newborns presenting characteristics of normal growth. The present study had been planned to measure the pulsatility index (PI) and resistive index of the middle cerebral artery with pulsatility and resistive index...
High speed network packaging solutions have pushed the limits of known manufacturing technology into previously untested realms. Next generation ASIC's and SiP/MCM's are requiring packages in excess of 60mm × 60mm. These large package sizes present both significant manufacturability and reliability challenges. Developing new solutions which can adequately accommodate the needs of high speed interconnect...
The pad cratering phenomenon has caused considerable concern as a type of latent defect that can impact long term reliability. Studies have concluded that the risk for pad cratering is elevated as the industry transitions to lead-free assemblies. In the past, characterization of pad cratering resistance has been problematic because typical board level reliability tests rely on monitoring the electrical...
The major purpose of the mechanical stress screening is to screen out the products which have potential defects which lie in materials, design, process, and operation etc. If the screening is thorough before the products are shipped, the rate of the abnormal failure at the users' side can be eliminated or lowered significantly. The manufacturing lot which goes through appropriate screening will have...
The microstructure and mechanical behavior of Sn-Ag-Cu (SAC) soldering alloys can change significantly over time when exposed to isothermal aging and in-situ current stress. Electronics assemblies built with SAC solder joints are exposed to elevated ambient temperatures and relatively high current densities for prolonged periods of time. Therefore it is important to understand the impact of these...
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