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Alkali silicate glass (ASG) coatings were investigated as a possible method for inhibiting tin whisker initiation and growth. The aqueous-based ASG formulations used in this study were deposited with equipment and conditions that are typical of those used to apply conventional conformal coatings. Processes for controlling ASG coating properties were developed, and a number of ASG-based coating combinations...
Galinstan, a gallium, indium, and tin eutectic, may be exploited for enhanced cooling of microelectronics because of its favorable thermophysical properties. A careful evaluation of its cooling potential, however, has not been undertaken. Provided here is a first-order model to compute the total (i.e., caloric plus conjugate conduction and convection) thermal resistance of galinstan-based heat sinks...
Liquid metals, such as Galinstan, a gallium, indium and tin eutectic, may be exploited for enhanced cooling of microelectronics due to their favorable thermophysical properties. Hodes et al. [1] discussed the properties of Galinstan compared with those of water and provided a first-order model for minimizing the total thermal resistance of Galinstan-based heat sinks under form factor and pressure...
Galinstan, a gallium, indium and tin eutectic, may be exploited for enhanced cooling of microelectronics due to its unique thermophysical properties. However, a critical evaluation of the cooling potential of galinstan has not been undertaken. Provided here is a first-order optimization model to minimize the total thermal resistance of galinstan-based heat sinks under constraints on form factor and...
This paper describes a 1 mm thick substrate with integrated flow channels to circulate liquid metal that is pumped with an electromagnetic pump. The substrate was fabricated using conventional circuit board assembly methods. Tests were performed with pumping current of up to 10 amps, which corresponded to a pumping power of 450 mW. This testing showed that the substrate had an effective thermal conductivity...
This paper describes a family of composite materials that are based on Alkali Silicate Glass (ASG), which can be processed and cured at temperatures that are compatible with conventional electronics packaging processes. The focus of this paper is on ASG composite materials with high thermal conductivity filler materials for use as thermal encapsulants and adhesives in electronics packaging. Data are...
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