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In general an IC needs to be assembled before being put on a microelectronics board by the end customer. The materials of which the IC is made and the materials for the assembly normally have different thermo-mechanical behavior. Temperature changes during manufacturing, testing and application will therefore cause stresses in the materials. These stresses, in extreme cases, may cause serious damages...
Moisture induced failure in plastic encapsulated packages is one most important failure mechanisms in microelectronics. This failure is driven by the mismatch between different material properties, such as CTE, CME (Coefficient of Moisture induced Expansion) caused by moisture absorption in plastic packaging materials. Therefore, it is important to know moisture effects on mechanical properties of...
Moisture induced failures in the plastic encapsulated packages are one most important failure mechanisms in microelectronics. These failures are driven by the mismatch between different material properties, such as CTE, CME (Coefficient of Moisture induced Expansion) and degradation of interface strength caused by moisture absorption of polymer materials. Therefore, it is critical to know how much...
Embedding of discrete semiconductors into substrates has the advantages of achieving high degree of miniaturization, good electrical performance and possible low cost. A MOSFET power package based on the embedded die technology was developed and the demonstrators were built. To reduce cost and time-to-market, thermo-mechanical virtual prototyping is applied to support the package development. 2D and...
In this paper, the interaction between chip and package is investigated with the focus on low ppm-level failures. More specifically, the failure mode of inter-metal shorts is investigated, caused by either electrical discharges (ESD) or internal/external mechanical forces. It is demonstrated that forces induced by the filler particles in the molding compound can cause these shorts. Finite element...
Since recent years, the micro-electronic industry changes the material usage, design and structure, in order to satisfy the customer demands of the higher performance and smaller size. One of the examples is the change of the basic materials from Al/SiO2 to Cu/low-k in IC interconnect structure. As a consequence, new reliability issues at device/product level have been discovered, and most of the...
The use of the non-hermetic material for electronic packaging does raise a potential concern, i.e. moisture induced interfacial delamination and pop corning during reflow. Therefore, it is very important we can correctly model the moisture absorption property. In this study, moisture absorption and desorption properties of three kinds of package materials were investigated. Moisture absorption equilibrium...
In this work the impact of the layout of the top metal of the integrated circuit (IC) and the most relevant process and material parameters of IC wafer fab and assembly fab on package stress induced damages to the ICs during temperature cycling is studied by means of thermo-mechanical simulations with experimental verifications. Besides die size, the materials for passivation, silicon thickness, molding...
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