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A study on high-density high-speed SerDes (HHS) designs in buildup laminate flip chip ball grid array (fcBGA) packages is presented in this paper. Experiences have shown that three main capacitive discontinuities happen in flip chip bump area, core PTH via area and BGA transition area. Literature [1] have studied three PTH via configurations for differential pairs and suggested that a routing structure...
We provide a practical example of concurrent design practice employed to optimize system level design specifications. Through package level modeling it was possible to improve the performance of a die I/O assignment. 3D EM modeling of the package flip-chip interconnect revealed that a significant improvement in the differential cross talk levels could be achieved by simple re-ordering of the die pad...
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