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In this paper, a fast circuit simulation technique based on the Latency Insertion Method (LIM) is proposed for the electro-thermal analysis of circuits and high-performance systems. The method is applied to the modeling of on-chip and off-chip 3D-interconnect networks. The proposed method is shown to be capable of modeling both electrical and thermal phenomena occurring in high speed, high performance...
In this work the latency insertion method (LIM) is applied to the treatment of blackbox networks described by their frequency-domain scattering parameters. The method allows the simulation of passive macromodels in the LIM environment. This generalization allows LIM to simulate subnetworks with frequency-dependent parameters describing phenomena such as skin effect and substrate loss. The derivation...
In this paper, a fast circuit simulation technique based on the Latency Insertion Method (LIM) is proposed for the steady-state analysis of large-scale networks, such as on-chip power grids. The proposed method is shown to be very efficient for modeling of networks with very large numbers of nodes. The comparison with one of the best methods used for the power grid analysis today, the Random-Walk...
Process scaling has led to a significant growth in the number or devices on a chip. Consequently, the length and density of interconnects has increased dramatically. Tradional matrix-vector product based circuit simulations such as SPICE are not computationally efficient for analysis of large circuit problems. This work demonstrates that latency insertion method (LIM) algorithm can be extended to...
In this work an extension of the Latency Insertion Method (LIM) formulation to the treatment of networks with frequency-dependent parameters is discussed. It is shown that the algorithm can be transformed to allow efficient simulation of both skin effect of conductors as well as frequency dependent substrate loss in high speed circuit interconnects.
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