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Goldmann Constants and Norris-Landzberg acceleration factors for lead-free solders have been developed based on principal component regression models (PCR) for reliability prediction and part selection of area-array packaging architectures under thermo-mechanical loads. Models have been developed in conjunction with Stepwise Regression Methods for identification of the main effects. Package architectures...
Leading indicators of failure have been developed based on high-frequency characteristics, and system-transfer function derived from resistance spectroscopy measurements during shock and vibration. The technique is intended for condition monitoring in high reliability applications where the knowledge of impending failure is critical and the risks in terms of loss-of-functionality are too high to bear...
In this paper, a mathematical approach for interrogation of system state under cyclic thermo-mechanical stresses has been developed for 6-different leadfree solder alloy systems. Data has been collected for leading indicators of failure for alloy systems including, SnlAg0.5Cu, Sn3Ag0.5Cu, Sn4Ag0.5Cu second-level interconnects under the application of cyclic thermo-mechanical loads. Methodology presented...
In this paper, a mathematical approach for interrogation of system state under cyclic thermomechanical stresses has been developed for three-different leadfree solder alloy systems. Data has been collected for leading indicators of failure for alloy systems including, Sn1Ag0.5Cu, Sn3Ag0.5Cu, Sn4Ag0.5Cu second-level interconnects under the application of cyclic thermo-mechanical loads. Methodology...
The current state of the art in managing system reliability is geared toward the development of predictive models for unaged pristine materials. The current state of art allows the prediction of time-to-failure for a pristine material under known loading conditions based on relationships such as the Paris' power law , , the Coffin-Manson relationship [2], [13], [23], [24], and the S-N diagram. There...
In this paper, the modeling approaches for first-level solder interconnects in shock and drop of electronics assemblies have been developed without any assumptions of geometric-symmetry or loading symmetry. The problem involves multiple scales from macro-scale transient-dynamics of electronic assembly to micro-structural damage history of interconnects. Previous modeling approaches include, solid-to-solid...
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