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Mobile phones, tablets and other hand held devices are pushing technology to new heights. These devices continue to add greater functionality while decreasing in size. This miniaturization demands tighter pitch, finer lines and better signal integrity. Nowhere is this clearer than in the IC substrate market. Semi-Additive Processing or SAP has been widely used in the manufacture of tighter pitch and...
This paper discusses a through-hole copper filling process for application to high density interconnect constructions and IC substrates. The process consists of two acid copper plating cycles. The first cycle uses periodic pulse reverse electroplating to form a bridge in the middle of the hole, followed by direct current electroplating to fill the resultant vias formed during the bridge cycle. This...
Printed circuit designers continually increase the technological complexity of their products. This includes more utilization of microvias and higher population densities via decreases in pitch. Many of these products will also require the application of thinner copper foils (< 17 microns) to resolve tighter lines and spaces. Building these more complex products often pushes the limits of capability...
For wiring boards used in electronic equipment, the demand for a flexible wiring board is increased due to its lightweight, thin features and flexibility. A typical construction of the flexible wiring board includes a polyimide film, used as an electrically insulating base material, a thin metal tiecoat, a copper seedcoat, and a layer of electrodeposited copper. The tiecoat metal is either chromium...
MultiPrep is a cupric chloride-hydrochloric acid based micro etchant process developed by MacDermid, Inc. based in Waterbury, CT, USA. This process provides a unique roughened copper surface, which yields excellent adhesion for both solder mask and dry film photo resist applications. The process also yields excellent solder mask adhesion through subsequent silver, tin and nickel plating post solder...
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