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A comprehensive chip-package-system (CPS) electrostatic discharge (ESD) simulation methodology is developed for addressing IEC61000-4-2 testing conditions. An innovative chip ESD compact model is proposed, combined with full-wave models of the ESD gun, ESD protection devices, PCB wires/vias and connectors for CPS analysis. Two examples of CPS ESD application are illustrated demonstrating good correlation...
Electrostatic discharge (ESD) is often the cause of system-level failure or malfunction of embedded systems. The underlying faults are difficult to localize, as the information gained from the hardware-based diagnostic methods typically in use lacks sufficient detail. The alternative proposed in this paper is software instrumentation that monitors key registers and flags to detect anomalies indicative...
This paper illustrates the use of software for monitoring and recording the effects of electrostatic discharge (ESD) on the operation of embedded systems, with the goal of facilitating root-cause analysis of resulting failures. Hardware -- based scanning techniques are typically used for analyzing the effect of ESD on systems by identifying physical coupling paths. This paper proposes software techniques...
If a PCB is struck by an ESD the injected current spreads throughout the PCB and returns via attached cables. During the current spread a variety of effects occur: The current spreads on the main ground and power planes, couples into traces and IC lead-frames and bond wires. Further, the PCB and the attached cables can form resonators causing ringing at their natural resonance frequencies. Understanding...
This work demonstrates a simple experimental setup to measure ESD-induced voltage to traces on a printed circuit board when ESD current is injected directly onto the outside of a metal case and presents how the induced voltage can be affected by the physical structure of the PCB ground and the metal case. The correlation between ESD-induced voltage and the method of connecting the PCB and chassis...
This paper provides a SPICE-compatible circuit model for characterizing electrostatic discharge (ESD) clamping performance of protection devices mounted on printed circuit boards (PCBs). An equivalent circuit model for a commercial ESD generator is introduced and a simulation methodology of an ESD protection device with non-linear resistance characteristic using voltage controlled current source is...
In this paper, we propose an equivalent electrical circuit model of a 40-pin board-to-FPC (flexible printed cable) connector for high frequency signal transfer characteristics. We fabricated an interface board to be fitted in FPC connector (0.5 mm pitch), which enables probing to measure signal transfer characteristics of 40-pin FPC connector. When S-parameters are measured, the unused ports have...
System level ESD tests can only be performed after hardware is available. Simulating the ESD coupling into a circuit allows at least parametric and quantitative studies of the expected ESD behavior. A complete simulation requires us to model the ESD generator, the passive elements of the DUT and the response of the ICs to injected noise. Having the ultimate objective of combining IC soft error response...
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