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Implementation of Pb-free electronics has resulted in use of pure Sn surface finishes which are known to pose reliability issues due to the spontaneous growth of Sn whiskers. In this study, atomic force microscopy (AFM) has been used to investigate the effect of surface roughness on Sn whisker growth. The varying (brass) substrate roughness conditions have been created by an unpolished, an electrochemically-polished,...
With the implementation of RoHS directives regarding Pb-free electronics, pure tin (Sn) films and board finishes offer potentially serious reliability issues due to Sn whisker formation. A key aspect of Sn whiskers is their material composition, which has been assumed pure crystalline Sn since 1951. Due to the submicron width (~ 0.25 mum) of high aspect ratio whiskers, it has been difficult for even...
Liquid crystal polymer (LCP) is being utilized in a variety of applications that could benefit from the realization of ultra fine pitch conductive traces on the surface of the LCP substrate. LCP has unique chemical properties that not only benefit the intended application, but can also be exploited to realize ultra fine pitch traces. Through a series of experiments, it was discovered that a thin film...
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