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The DARPA COmpound semiconductor materials on silicon (COSMOS) program is developing processes to enable transistor-scale heterogeneous integration of advanced compound semiconductor (CS) devices with state of the art silicon circuits. The approaches to achieve this program goal include micro assembly, monolithic epitaxial growth, and epitaxy layer bonding processes. In Phase I of the program, performers...
This paper will describe the development of a technique for comparing the performance of Sub-MMW Imagers used for detecting objects concealed under clothing. The analysis is separated into 4 independent elements that can be calculated separately so that tradeoffs in transmitter and receiver characteristics can be performed. The derivation of the analysis and various examples of tradeoffs will be presented.
Devices operating at frequencies above 100GHz have been an area of intense development recently within both the solid-state and vacuum electronics worlds. This talk will discuss some of the recent results in both electronic domains and considers salient features of some applications which are creating an opportunity for vacuum electronics to once again be an enabling technology for extending the available...
The Wide Band Gap Semiconductor for RF Applications (WBGS-RF) program, supported by the Defense Advanced Research Projects Agency (DARPA), is developing microwave and millimeter-wave gallium nitride-based devices on silicon carbide substrates. Recent advances within Phase II of the Program include excellent results for both performance and reliability. Significant progress has been made towards developing...
This paper summarizes recent improvements in the performance and reliability of microwave and millimeter-wave wide-bandgap gallium nitride on silicon carbide devices and their promise for future integrated circuits. Many recent advances have been made as a result of the on-going Phase II wide band gap semiconductor for RF applications (WBGS-RF) program funded by the Defense Advanced Research Projects...
Technologies to enable the next generation of transmit/receive modules for sensor and communications systems are being pursued in programs funded by the Defense Advanced Research Projects Agency (DARPA). DARPA programs contributing to dramatically improved performance and wafer-scale integration for T/R modules will be highlighted. These programs include the Wide Band Gap Semiconductors for RF Applications...
There has been significant recent interest in the application of MMW and submillimeter wave technology to develop imaging systems that can "see" though either adverse weather environments or through materials such as clothing or baggage. This paper describes elements of a study of three system applications and a definition of a common sub-aperture concept that would satisfy each
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