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A study was initiated in order to thermally quantify the characteristics of package-on-package (POP), which has been deployed in multiple mobile devices in order to reduce board area and subsequently mobile device size. In most POP scenarios, the memory package is stacked on top of a baseband or application processor and reflowed together. Thermal simulations were conducted for a POP package configuration...
Wafer level chip scale packaging (WL-CSP) of connectivity RF components for mobile devices has emerged as a low-cost, enabling technology. WL-CSP devices are electronic components with an exposed die that utilize a ball pitch compatible with standard surface mount technology (SMT) equipments, and common PCB design techniques. WL-CSP allows the devices to be directly mounted on the PCB of portable...
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