The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
SiP modules have been widely used in consumer electronic products. Many different functions are integrated in a SiP module, and these functions generate electromagnetic coupling interference between one another at different frequencies. In order to maintain high performance in all functions in a SiP module, it is necessary to prevent coupling electromagnetic interference (EMI) between adjacent electronic...
This paper presents the electrical characterization of fine line design. For this kind of very thin and narrow fine lines in high density substrate, the trace is no longer lossless or low-loss transmission line and the characteristic impedance is also varying with frequency. This phenomenon on high density substrate will lead to different design guideline from conventional one. In this paper, the...
Serial data (SerDes) link has been widely used in gigabit rate link, storage applications, telecom, data communications, etc. The ability to accurately predict SerDdes channel insertion loss and return loss plays a critical role in prediction of SerDes link performance. Two test vehicles are designed to demonstrate the step-by-step modeling technique. One is the bare package sample, and the other...
A potential technology by silicon interposer enables high bandwidth and low power application processing devices of the future, because the demand of smart mobile products are driving for higher logic-to-memory bandwidth (BW) over 30 GB/s with lower power consumption and ultra-memory capacity. This paper presents a 2.5D-IC structure with silicon interposer to demonstrate electrical performances including...
A potential technology by silicon interposer enables high bandwidth and low power application processing devices of the future, because the demand of smart mobile products are driving for higher logic-to-memory bandwidth (BW) over 30 GB/s with lower power consumption and ultra-memory capacity. This paper presents a 2.5D-IC structure with silicon interposer to demonstrate electrical performances including...
A potential technology by silicon interposer enables high bandwidth and low power application processing devices of the future, because the demand of smart mobile products are driving for higher logic-to-memory bandwidth (BW) over 30 GB/s with lower power consumption and ultra-memory capacity. This paper presents a 2.5D-IC structure with silicon interposer to demonstrate electrical performances including...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.