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Metal degradation has recently received increased attention as a failure mechanism in power devices under active cycling conditions, i.e. under repeated pulsed voltage/current loads. Both electro-thermal and thermo-mechanical simulation are indispensable for understanding this mechanisms. The paper presents experimental and simulation data for a dedicated test structure. A suitable lifetime model...
Currently, various mainly tin-based lead free solders are in use or under evaluation. Many solder fatigue models have been developed to predict the fatigue life of solder joints under low-cycle fatigue conditions, however, because of the diversity of solders, more work is needed in this respect. The theoretical fatigue life prediction of solder joints, based upon non-linear finite element (FE-) calculation...
Abstract form only given. Lifetime prediction for advanced packaging faces two challenges in the future: lifetime models for the nano-domain (material level) and consistent methodologies for a system approach. Either must incorporate a physics of failure based concept as well as simulative and experimental procedures to analyse failure mechanisms and describe them theoretically on different length...
A combined numerical-testing methodology was developed for microscopic in-situ observation of fatigue failure of small material volumes thermo-mechanically loaded in shear, which was applied to Sn95.5Ag3.8Cu0.7 (SAC) solder. Different temperature cyclic environments were investigated: test cycles of -40degC to 125degC and field cycles of 0degC to 80 degC. Fatigue testing was accompanied by FE-modeling...
A wafer level packaging technology ELASTecreg has been developed; which uses a resilient bump contact system. The advantages are twofold; because on the one hand the elastic contact system simplifies wafer probing and on the other hand the elastic interconnects allow an increase in board level reliability. Excessive solder bump straining caused by the mismatch of thermal expansion coefficients (CTE)...
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