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The wireless world is shrinking and so is the size of all electronic wireless devices which is aggressively pushing the chip manufacturers to reduce the size and power consumption of their IC's. This work presents a similar case wherein all the blocks of a FEM are tightly integrated on a single die measuring 1500 times 1350 um2 using GaAs E/D p-HEMT process and packaged in 3 times 3 times 0.7 mm3...
In the fast evolving wireless communication market, the need to have a fully integrated RF front end module (FEM) is highly felt where in all the blocks of FEM are on a single chip. For the vendors the reduced firm factor and availability of a complete integrated solution enables rapid market entry and the freedom to focus on value added branding. RF arrays has developed a single chip 802.11b/g FEM...
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