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3D integration provides opportunities to design high-bandwidth and low-power CMOS image sensors (CIS) [1–4]. The 3D stacking of pixel tier, peripheral tier, memory tier(s), and compute tier(s) enables high degree of parallel processing. Also, each tier can be designed in different technology nodes (heterogeneous integration) to further improve power-efficiency. This paper presents a case study of...
The paper is on generic service-level management tools that enable the reconfiguration of a distributed network application whenever there are resource-level changes or failures in the underlying network sub-systems. We present a formal model-based approach for monitoring compliance and adapting the system in response. In our model, the management entity maintains policy scripts and rules to coordinate...
The paper comes up with the variation of slope compensation with step load and duty cycle for one cycle control in a peak current controlled dc-dc buck converter. For an optimal performance under varying load conditions and input voltage the amount of slope compensation desired, vary dynamically. A conventionally used linear slope is definitely not a solution. To meet the dynamic requirement of slope...
We present a generic method for analyzing the effect of process variability in nanoscale circuits. The proposed framework uses kernel and a generic tail probability estimator to eliminate the need for a-priori density choice for the nature of circuit variation. This allows capturing the true nature of the circuit variation from a few random samples of its observed responses. The data-driven, non-parametric,...
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