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Due to inappropriate assignment of bump pads or improper placement of I/O buffers, the configured delays of I/O signals may not satisfy the timing requirement inside die core. In this paper, the problem of timing-constrained I/O buffer placement in an area-IO flip-chip design is firstly formulated. Furthermore, an efficient two-phase approach is proposed to place I/O buffers onto feasible buffer locations...
Given a set of n IO buffers and a set of n bump balls on a re-distribution routing layer, an O(n(logn)2) routability-driven partition-based IO assignment is proposed to assign n IO connections for RDL routing in a flip-chip design. Firstly, based on the recursive partition of bump balls and IO buffers, the partition-based IO assignment can be obtained by using the geometrical mapping between bump...
Given a set of IO buffers and bump balls with the capacity constraints between bump balls, an O(n2) IO assignment and RDL routing algorithm is proposed to assign all the IO connections and minimize the total wirelength with satisfying the capacity constraints and guarantee 100% routability if the capacity constraint is permitted, where n is the number of bump balls in a flip-chip design. Compared...
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