The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The design of high-speed metallic interconnects such as microstrips requires the correct characterization of both the conductors and the surrounding dielectric environment, in order to accurately predict their propagation characteristics. A fast boundary integral equation approach is obtained by modeling all materials as equivalent surface charge densities in free space. The capacitive behavior of...
The manufacturing of interconnects often leads to conductors with a non-rectangular cross-section. Especially for sharp edges, it is therefore important to study the influence of corner effects on the interconnect circuit characteristics. Firstly, the electromagnetic behavior of a finite conducting 2-D wedge is investigated. Secondly, as an application example, a broadband transmission line model...
A quasi-TM reciprocity based multi-conductor transmission line model is used to investigate the influence of the geometry on the performance of on-chip transmission line pairs for high-frequency differential signal transmission. It is shown that both the knowledge of the fundamental transmission line modes and of the internal impedance of both connected circuits, are essential for a good design.
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.