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This paper reports the development of a tactile sensor that is able to detect 3-D forces for minimally invasive surgery (MIS) applications. The sensor consists of a central silicon post and a polyimide bottom diaphragm integrated with symmetric polysilicon piezoresistors. A straightforward fabrication process using Deep Reactive Ion etching (DRIE) was employed. A simple but effective packaging scheme...
This paper reports the successful prototype development of a novel intelligent textile technology based on the integration of silicon flexible skins with regular textiles. This novel approach enables the embedding of sensing and computational components into textiles without compromising the flexibility of the textiles. Silicon flexible skins comprising of arrays of silicon islands integrated with...
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