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Through Silicon Via (TSV) is now becoming one of the most critical and enabling technologies for 3-D integration.Vertical interconnection of several chips offered by TSV will result in improved performance and functionality, miniaturization in size and weight and reduced power consumption. Cu as TSV filling material is well used in the traditional damascene process. In this work, Cu seed deposition...
Glucocorticoid induced tumor necrosis factor receptor ligand (GITRL) is a type II transmembrane protein with homology to TNF receptor superfamily members, and its human receptor (hGITR), an ortholog of the recently discovered murine glucocorticoid-induced TNFR-related (mGITR) protein. Ligation of murine GITR/GITRL can enhance immunity reactions via several signal pathways. However, so far the certain...
Full factorial design (2 level) is used to study the F% influenced by the different process parameters, gas flow, power etc. X-SEM study on gap-filling and metal top line clipping (metal clipping) is also performed. High temperature vacuum baking is used to study the fluorinated-silicate-glass (FSG) film stability. Dielectric constant of bulk FSG with different F% is extracted by MIS structure
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