The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper presents the design and implementation of engineered nanoscale bonding interfaces as an effective strategy to improve manufacturability of Cu-Cu bonding to the level where it can, for the first time, be applied to chip-to-substrate (C2S) assembly. All-Cu interconnections are highly sought after to meet the escalating electrical, thermal, and reliability requirements of a wide range of emerging...
High-performance computing is driving sub-10µm substrate interconnect pitches to support high-density logic-to-memory interconnections in advanced 2.5D packaging. A new ultra-thin surface finish, electroless Pd autocatalytic Au (EPAG), was recently developed by Atotech GmBH to address extraneous plating encountered at these fine pitches with conventional finishes, such as electroless Ni immersion...
A novel technology for building hermetic optical subassemblies based on silicon is presented which supports precision alignment features, integration of passives, outstanding RF-performance and waferscale assembly and testing. Examples of OSAs will be shown
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.