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The use of a vaporizable dielectric fluid is proposed and demonstrated in a proof-of-concept electrical drive system utilizing medium-range 1200 VAC 450 A IGBT devices. Comparative empirical data is shown for a drive system utilizing production components for a traditional air-cooled extruded aluminum heat sink thermal solution for each IGBT module, versus several water-cooled liquid cold plate solutions...
CVD diamond segments inserted into an extremely high thermal conductivity graphite heat spreader within an expansion-matched composite structure are described as a semiconductor packaging material construction. These development materials are evaluated to address high heat flux spreading requirements of on-die hot spots and the need to match differing coefficients of thermal expansion with other packaging...
Characterization of thermal properties of thermal interface materials (TIMs) has gained increasing importance as the relative percentage of overall semiconductor package material thermal resistance attributable to the TIMs has increased. The development of new TIM materials has increasingly focused on materials with very high performance and, in certain instances, with very thin in-situ application...
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