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Ball grid array (BGA) carriers use solder balls as interconnects between package and underlying substrate. Stress will be introduced to the solder joints during thermal excursions when the ceramic BGA carrier is interconnected to a standard FR-4 printed circuit board (PCB) substrate due to mismatch in coefficient of thermal expansion (CTE). This has traditionally been overcome by added solder joint...
The insulating layer in the transistor has decreased from 100 nm in the early 1970s to only a few nanometers today. This thin insulating layer gives rise to very high electric fields approaching 1000 kV/mm for an operating voltage of 1 V. Degradation of the insulation during ageing takes place due to the high field and may eventually lead to a breakdown. Currently it seems that the reliability of...
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