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We have investigated the electrical properties of interface engineered junctions fabricated under various process conditions to clarify the possible origin of the spreads in I/sub c/ and R/sub n/ values. We found that in most cases, the I/sub c/R/sub n/, values of junctions on a wafer scaled with the square root of I/sub c/. The distribution of both the junction I/sub c/ and R/sub n/ were expressed...