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This paper reports on a wafer-level thin film vacuum packaging technology for MEMS. It is based on the fabrication of freestanding porous anodic alumina membranes of a typical thickness of 2 to 3µm, featuring cylindrical nanopores that are a mere 15–20nm in diameter (aspect ratio >100). The fabrication process involves in situ perforation of the thin AlOx barrier layer present at the bottom of...
An interconnect technology for out-of-plane biomedical probe arrays has been demonstrated. The shafts of the probe array are assembled perpendicular to a common base or platform. During assembly of the probes a mechanical and electrical connection has been made. In order to assess the integrity of the assembly, a pulling test has been done. Recently the interconnect density has been improved to a...
The electronic subsystem of wearable and implantable devices is constructed using board-level and package-level integration technology and this limits the achievable miniaturization. We will show that this limitation can be overcome by emerging wafer-level integration methods such as chip-in-wire technology. These technologies can even achieve mechanically bendable and stretchable subsystems.
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