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Microelectronic packaging devices consist of various kinds of materials, such as: die, molding compound, adhesives, copper etc. Due to the mismatch of the materials coefficient of thermal expansion (CTE), thermal stress can accumulate in the device, which would cause the interface delamination of microelectronic packaging devices when ambient temperature changes, and eventually lead to the failure...
BGA device is always inefficient for its solder joints, of which part the interface intermetallic compounds (IMC) is most likely to crack. What's more, interfacial reactions are becoming more complex these days as the lead-free alternative becoming an urgent requirement for electronic industry and various materials being applied in electronics packaging application. Taking account of the above reasons,...
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