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Phenol-Formaldehyde (PF) resoles exhibit excellent thermal properties, high temperature degradation and high char yield. The formaldehyde can be replaced by terephthalaldehyde (TPA), a non-toxic aromatic dialdehyde. The thermal performances of phenol-TPA (PTPA) resole are very interesting for further development and industrialization. The present investigation presents for the first time a thermo-kinetics...
Despite an abundant literature on epoxy-amine systems, a complete description of the curing kinetics in epoxy-phenol composites was still lacking. In this study, the curing kinetics of an epoxy-phenol composite relevant to microelectronics industry is probed by isothermal and non-isothermal differential scanning calorimetry. An isoconversional analysis of the data reveals a significant contribution...
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