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The thermal management of high-power light-emitting-diode (LED) devices employing various die-attach materials is analyzed. Three types of die-attach materials are tested, including silver paste, Sn–3wt.% Ag–0.5wt.% Cu (SAC305) solder, and SAC305 solder added with a small amount of carbon nanotubes (CNTs). The analysis of thermal management is performed by comparing the temperatures of the LED chips...